The Nucleus

Internet of Vehicles Environment Verification of Authentication Protocols using Formal Analysis: A Survey

2024-09-02T07:57:20+05:00

The Internet of Vehicles (IoV) is becoming an interesting topic among researchers and it has emerged as a rapidly advancing field within Vehicular Ad-hoc Networks, facilitating intelligent communication between vehicles and the cloud through the integration of Internet of Things (IoT) technologies. The IoV surroundings face serious challenges due to the highly interrelated nature of vehicles and infrastructure in certifying privacy and security. Traditional approaches to authentication lack the strength required to protect against developing fears, leaving systems vulnerable to attacks. This survey addresses the gap by employing formal analysis approaches to prove authentication protocols, targeting to reinforce safety and confidentiality in IoV systems. The IoV communication model consists of Vehicle-to-Vehicle, Vehicle-to-Infrastructure, Vehicle-to-Personal Devices, and Vehicle-to-Cloud. Smart automobiles are equipped with cameras, radars, on-board units, and sensors to help reduce the number of accidents by giving drivers or autonomous vehicles up-to-date information on roads, traffic signals, and other pertinent entities. As human lives are at risk, security and privacy in the IoV communication paradigm are critical and cannot neglected. Security and privacy breaches may cause accidents because the attacker can inject false information into the system as the communication channel is open and unsecured. The researchers proposed many authentication protocols to provide secure communication between IoV entities. Although surveys on IoV security and privacy issues deal with communication and computation costs, they lack formal analysis of the authentication protocols. This survey reviews the informal analysis and formal analysis methods used by various authentication protocols. Furthermore, the challenges and future work are also included in this survey.

Analysis and optimization of open micro-channel heat sink with pin Fins by modified grey relational optimization

2024-08-01T11:53:11+05:00

This work successfully utilized grey relational optimization in conjunction with the standard deviation objective weighting approach to improve various response parameters in a microchannel heat sink with pin fins, including: the surface Nusselt number and total surface heat flux. Six process parameters were chosen for the simulation research of the open microchannel heat sink with pin fins based on the L-27 orthogonal array. These parameters are heat sink length (L), heat sink width (W), number of fins (N), fin height (a), base height (b) and fin thickness (d). The surface Nusselt number and total surface heat flux were selected as the output parameters. This work aids in understanding the effect of various parameters on the open microchannel heat sink with pin fins. The standard deviation objective weighting - grey relational optimization method optimized the process parameters. ANSYS Fluent software was utilized to simulate the entire open microchannel heat sink with pin fins according to the L-27 orthogonal array. The optimal configuration for the process parameters was determined to be a heat sink length of 80 mm, width of 100 mm, 5 fins, fin height of 30 mm, base height of 8 mm and fin thickness of 2 mm. Among these parameters, the number of fins was found to be the most influential factor, followed by base height, fin thickness, width of the heat sink, fin height, and length of the heat sink. The findings indicate that these parameters play a critical role in the thermal performance optimization of microchannel heat sinks.

Linear Attenuation Coefficient and Buildup Factor of Some Metals at 662 keV and 1332 keV

2024-08-01T08:06:56+05:00

The nuclear shielding properties of some metals like lead, copper, iron, aluminium and carbon were studied using 3ʺ×3ʺ. NaI(Tl) scintillation detector by the evaluation of shielding parameters such as the linear attenuation coefficient, and gamma-ray buildup factor. The linear attenuation coefficient of lead is very high compared to other materials used for the study. The buildup factors of these materials were observed to increase with the increase in the thickness of the material. The value of the buildup factor is found to be high at 662 keV and low at 1332 keV, and also the value of the buildup factors of lead is found to be very high compared to other materials used for the study.